Beijing, China, October 14, 2015 – Dialog Semiconductor, a wireless technology provider with highly integrated power management, AC/DC power conversion, solid state lighting (SSL) and Bluetooth Smart (Frankfurt Stock Exchange: DLG ), recently announced a partnership with Bosch Sensortec to develop a very low-power smart sensor platform using Bosch Sensortec's sensors and Dialog's smart Bluetooth technology. The result of this collaboration is the world's lowest power 12-degree-of-freedom (DOF) smart sensor reference platform for gesture recognition in wearable computing devices and immersive games, including augmented reality, 3D indoor drawing and navigation. The platform combines Dialog's DA14580 Smart Bluetooth System-on-Chip (SoC) with three low-power sensors from Bosch Sensortec: BMM150 for 3-axis geomagnetic field measurement; BME280 for pressure, humidity and temperature sensors; and 6-axis BMI160 (integrated) 3-axis accelerometer and 3-axis gyroscope in one chip). The final product is mounted on a 14 x 14 mm2 printed circuit board and uses a 3V coin cell battery to consume less than 500 μA when updating and wirelessly transmitting all 12 x 16-bit data to the smartphone. Udo-MarTIn Gomez, Chief Technology Officer of Bosch Sensortec, said: "The result of this close collaboration between Bosch Sensortec and Dialog is the world's lowest power smart Bluetooth networked sensor platform. Higher functional integration and lower power consumption are mobile consumer electronics. Key design goals for core devices. With the experience of our two companies, we have seen many opportunities to provide customers with a competitive edge by developing smaller, more integrated and more energy-efficient smart interconnect solutions." Mark Tyndall, senior vice president of business development and strategy at Dialog Semiconductor, said: "Our partnership with Bosch Sensortec combines state-of-the-art Bluetooth, power management and sensor technology to enable our customers to develop high performance with long battery life and Innovative products. The complementary strengths of the design teams of both parties enable us to help our customers stay at the forefront of technology in the development of the IoT market." Platform technology summary Dialog's DA14580 SmartBondTM SoC, adopted by many leading wearable device manufacturers, integrates a smart Bluetooth radio receiver, an ARM® CortexTM-M0 application processor, and intelligent power management. It extends the battery life of applicaTIon-enabled smartphone accessories, wearables or computer peripherals by more than double compared to competing solutions. The DA14580 includes a range of analog and digital interfaces and consumes less than 15 mW in operating mode, 600 nA standby current, and 2.5 x 2.5 x 0.5 mm, half the size of competitors. Bosch Sensortec's BMI1606 Axial Inertial Measurement Unit (IMU) integrates a 16-bit, 3-axis, low-g accelerometer and an ultra-low-power 3-axis gyroscope in a single package. When the accelerometer and gyroscope are in full operation mode, the typical current consumption is 950 μA, which is only half that of the nearest competitor. The BMM150 integrates a compact 3-axis geomagnetic field sensor using Bosch Sensortec's high-performance FlipCore technology. The BME280 integrated environmental unit integrates multiple sensors for air pressure, humidity and temperature measurements in a single package. The BME280's precise height measurement is a key requirement for applications such as indoor navigation with ground tracking. In addition, the BME280 has a first-class response time of only one second when measuring humidity, with accurate ambient temperature measurement and very low current consumption. About Dialog Semiconductor Dialog Semiconductor offers highly integrated standard (ASSP) and custom (ASIC) mixed-signal integrated circuits (ICs) for mobile computing, IoT, smart home and lighting applications. With decades of experience, Dialog is able to rapidly develop a wide range of ICs, providing business partners with flexible and dynamic support, world-class innovation and security services. Dialog works with world-class manufacturers to adopt a fabless business operation model. As an employer, Dialog actively assumes social responsibility and conducts activities to benefit employees, communities, other stakeholders and the natural environment. Dialog Semiconductor's DC-DC configurable system power management and other energy-saving technologies enhance efficiency and enhance the consumer's user experience by extending battery life and enabling fast charging of portable devices. The company's technology portfolio also includes audio, smart Bluetooth® Smart®, fast charging Rapid ChargeTM AC/DC power conversion and multi-touch technology. Headquartered in London, Dialog Semiconductor has sales, R&D and marketing facilities worldwide. In 2014, Dialog achieved revenue of approximately $1.16 billion and is one of the fastest growing listed semiconductor companies in Europe. Currently, the company has 1,500 employees worldwide. Dialog is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006) and its stock is a constituent of the German TecDax Technology Stock Index. About Bosch Sensortec Bosch Sensortec GmbH, a wholly owned subsidiary of Bosch GmbH, specializes in providing complete micro-electromechanical systems (MEMS)-based sensors and solutions for consumer electronics to help mobile devices feel and perceive the environment around them. Bosch Sensortec develops and markets a wide range of MEMS sensors, solutions and system products for a wide range of products in the areas of smartphones, tablets, wearables and the Internet of Things. Products include a wide range of inertia (acceleration, yaw rate), geomagnetic and environmental (atmosphere, humidity and gas) sensors, and a range of software products embedded in smart sensors. Since its inception in 2005, Bosch Sensortec has established itself as a technology leader in the respective markets. The Bosch Group has been a global leader in the MEMS sensor market since 1998 and has shipped more than 6 billion units of MEMS sensors to date. What is Car Ethernet Vehicle Router,Vehicle 4G Router,Vehicle 4G Wireless Router,Vehicle Wifi Router Shenzhen MovingComm Technology Co., Ltd. , https://www.movingcommtech.com
Car Ethernet is a new local area network technology that uses Ethernet to connect the electronic unit in the car. Unlike traditional Ethernet, which uses 4 unshielded twisted pair cables, car Ethernet can achieve a transmission rate of 100Mbit/s or even 1Gbit/s on a single pair of unshielded twisted pair cables. At the same time, it also meets the requirements of the automotive industry for high reliability, low electromagnetic radiation, low power consumption, bandwidth allocation, low latency and synchronous real-time. The physical layer of on-board Ethernet uses BroadRReach technology, and BroadR-Reach's physical layer (PHY) technology has been standardized by the One-pair Ethernet Alliance (OPEN). Therefore, it is sometimes called Broad RReach (BRR) or OABR (Open Alliance BroadR-Reach). The MAC layer of vehicle Ethernet adopts the IEEE 802.3 interface standard and seamlessly supports widely used high-level network protocols (such as TCP/IP) without any adaptation.
On-board Ethernet protocol architecture
Vehicle-borne Ethernet and its supported upper-layer protocol architecture are shown in Figure 1. Vehicle-borne Ethernet mainly involves OSI layer 1 and Layer 2 technologies, while vehicle-borne Ethernet also supports AVB, TCP/IP, DOIP, SOME/IP and other protocols or application forms.
On-board Ethernet framework
Among them, AVB is an extension of traditional Ethernet functions, which enhances the real-time performance of traditional Ethernet audio and video transmission by adding precise clock synchronization, bandwidth reservation and other protocols, and is a network audio and video real-time transmission technology with great development potential. SOME/IP (Scalable Service-Oriented MiddlewarE on IP) specifies the video communication interface requirements for vehicle camera applications, which can be applied to the field of vehicle cameras, and realizes the mode control of driver assistance cameras through apis.
As an extension of AVB protocol, Time-Sensitive Networking (TSN) introduces related technologies of time-triggered Ethernet, which can efficiently realize the transmission of automotive control information. In addition, the on-board Ethernet of the 1Gbit communication standard also supports Power Over Ethernet (POE) function and Energy-Efficient Ethernet (EEE) function. The POE function provides power for connected terminal devices while transmitting data through twisted pair cables, eliminating the need to connect external power cables to terminals and reducing the complexity of power supply.
On-board Ethernet standardization
In terms of in-vehicle Ethernet standardization, the IEEE802.3 and IEEE802.1 working groups, AUTOSAR, the OPEN Alliance and the AVnu Alliance have played a major role in promoting it.
The IEEE802.3 local area network standard represents the mainstream Ethernet standard in the industry, and the on-board Ethernet technology is developed on the basis of IEEE802.3, so the IEEE is currently the most important international standardization body for on-board Ethernet. In order to meet the requirements of the car, it involves the development of a number of new specifications and the revision of the original specifications within the two working groups of IEEE802 and 802.1, including PHY specifications, AVB specifications, and single-wire to data line power supply. In addition, AVB related to AV transmission, timing synchronization and other specifications also need to be standardized by other technical committees of IEEE, such as IEEE1722 and IEEE1588.
OPEN Alliance
The OPEN Industry Alliance was launched in November 2011 by Broadcom, NXP, and BMW to promote the application of Ethernet-based technology standards to in-car connectivity. The main standardization goal is to develop a 100Mbit/s BroadR-R physical layer standard and develop OPEN interoperability requirements.
AUTOSAR
AUTOSAR is a consortium of automotive manufacturers, suppliers, and tool developers that aims to develop an open, standardized automotive software architecture, and the AUTOSAR specification already includes the automotive TCP/UDP/IP protocol stack.
AVnu
The AVnu Alliance was formed by Broadcom in collaboration with Cisco, Harman and Intel to promote the IEEE 802.1 AVB standard and the Time Synchronization Network (TSN) standard, establish a certification system, and address important technical and performance issues such as precise timing, real-time synchronization, bandwidth reservation, and traffic shaping.