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LED as a light source has been hailed as the third revolution in the history of human lighting. It has the advantages of high efficiency, energy saving, green environmental protection, etc. It has set off a heat wave of development research on a global scale. While developing and developing technologies and developing markets, countries around the world are also actively staking the patent layout. The patent disputes in the LED field are constantly on the rise.
At present, there are more than 120,000 patent applications in the field of LED. As early as the 1960s, LED-related patents have appeared. In the late 1970s, the number of patent applications began to grow steadily (the average annual application volume exceeded 100), and the patents in 2000. The number of applications has started to grow rapidly, and the number of patent applications has increased dramatically in recent years (average 20,000 per year).
From the application area, Japan has the largest number of patent applications, followed by the United States and China, and the number of patent applications in the LED fields of major countries and regions has exceeded 10,000. Many LED industry giants belong to Japanese and American companies. Under normal circumstances, companies will first apply for new technologies in their own countries. Therefore, the number of patent applications in the LED field in Japan and the United States is far ahead. In the field of LED, the number of Chinese patent applications ranked third, indicating that the LED industry giants all attach great importance to the competition in the Chinese market, early in the country to carry out patent layout, set up patent barriers for other companies to enter the Chinese market.
About 40% of patent applications are concentrated on packaging
The reason for the large number of patent applications in the field of packaging and application is the large number of enterprises and more technical details.
From the perspective of industrial chain distribution, about 40% of patent applications in the LED field are concentrated in packaging, followed by applications (26%) and extension (17%), and the patents for substrates and white light are the least. The reason for the large number of patent applications in the field of packaging and application may be that there are a large number of enterprises engaged in the downstream development of packaging and application fields, and there are many technical details involved. Patent applications are mostly concentrated in the field of packaging and applications. It also shows that LED technology is relatively mature and has begun to enter the application stage. Although the number of patents in the field of substrate and white light is relatively small, most of them are the basic core patents of the LED industry, which are more important.
25% of the patents in the substrate field are concentrated in sapphire, followed by gallium arsenide (17%), silicon (16%), gallium nitride (10%), silicon carbide (7%), etc., and the current global LED market GaN The industry in which sapphire substrates are mainly grown is consistent, and sapphire substrates are the mainstream choice in terms of manufacturing technology maturity, stability and cost. At present, Japan's Nichia monopolizes most of the patented sapphire substrate technology. On the other hand, silicon substrates and silicon carbide substrates each have their own specific technical and market advantages, and they will also play a role in specific fields and occupy their own place.
From the perspective of active layer materials, 86% of the active layer materials are concentrated in the III-V family. LED devices made of III-V compound semiconductor materials represented by gallium nitride have high efficiency, long life and low cost. In order to be the preferred material for LED devices, the number of patent applications in the field of LED epitaxy also reflects the current state of the art. From the functional layer, 75% of the patents in the epitaxial field are concentrated on the n-type layer, the p-type layer and the active layer, followed by the cover layer and the buffer layer (16%), and the application amount of the technology branch such as the current spreading layer and the ohmic contact layer is compared. less. The n-type layer, the p-type layer, and the active layer are the basic structures of the LED device, and thus the patent application amount is the largest. The epitaxial buffer layer technology can effectively solve the two problems of lattice mismatch and thermal mismatch in the growth of gallium nitride on a heterogeneous substrate. It is the traditional mainstream technology of LED, which appeared earlier and has a relatively large number of patent applications.
39% of patents in the chip field focus on electrode design technology, followed by reflective film technology (16%), microstructure technology (12%), chip shape technology (11%), and substrate bonding and stripping technology (11%). There are fewer applications for dicing, anti-reflection coating technology, and passivation technology. One of the advantages of LED is long life, and the electrode design (shape, position, preparation, etc.) has a great influence on the stability of LED. It is very important for the practical use of LED, and it is the technology branch with the largest number of patent applications in the chip field.
63% of the patents in the packaging field are concentrated in the field of substrates and packages, followed by heat dissipation (15%), electrode interconnection (13%) and phosphors (7%). The development trend of LED packaging technology is high luminous efficiency, high reliability and thinness, among which heat dissipation technology is the most important. If the heat dissipation problem is not solved, the operating temperature of the LED device will rise continuously, which will directly lead to the weakening of the brightness of the LED device and the decay of the working life. Therefore, the patent of this technology branch is worthy of attention of Chinese enterprises. 
The number of patents in the LED industry is huge, involving many technical fields. Foreign large enterprises have an early layout and strong strength. They have formed alliances through patent cross-licensing, and have formed a patent pressure on China's LED enterprises.