STIC launched a new data encryption chip across multiple electronic applications, the world's leading semiconductor supplier and data security technology provider STMicroelectronics (ST), which will significantly reduce confidential information for PCs and laptops. The cost of the business and government agencies or government agencies when the cost of the sensitive information stored in the laptop is lost or stolen. The chip, called HardCache-SL3/PC, is the industry's first single-chip data encryption engine that integrates the FIPS 140-2 Level 3 security standard encryption module. The National Institute of Standards and Technology (NIST) FIPS 140-2 Level 3 security standard is recognized as the world's most stringent non-military data security standard. This article refers to the address: http:// Via In Pad PCB Via In Pad PCB Via In Pad PCB,6Layer Via In Pad PCB,Touch Pad PCB,Via In Pad Storm Circuit Technology Ltd , http://www.stormpcb.com
The FIPS 140-2 Federal Information Processing Standard is the US government's cryptographic module technical requirements standard. Originally developed for US government agencies, FIPS 140-2 is now a recognized data security standard in the United States and around the world, and is currently being developed as an international data security standard ISO 19790. As individuals or businesses experience losses due to the loss and leakage of sensitive or confidential information, data security standards are becoming more important. In addition, countries around the world have enacted numerous new regulations to strengthen data security and privacy protection, which will inevitably increase the legal and financial risks faced by substandard companies.
Francesco Brianti, Vice President of Open Markets, STMicroelectronics, said: "The HardCache-SL3/PC solution has achieved NIST's highest non-military security level certification, becoming the new industry reference standard, and will have a wide range of customers at an affordable price. Group. Our leadership in trusted platform modules, smart cards, and set-top box system security features demonstrates that STMicroelectronics has been providing customers with the best security solutions. Today, we launched the world's first FIPS 140-2 A three-level security standard encryption chip introduces such professional and secure technology into the secure computer market."
To date, the cost of obtaining a third-level security standard is still high, and few computer and data storage vendors can afford this huge cost. As a result, most secure computer products use software data encryption solutions, but this approach not only fails to achieve a second-level security level, it also reduces the performance of the computer. HardCache-SL3/PC solves this problem. The chip's built-in hardware encryption engine can perform the encryption and decryption algorithms required by the system to store data from memory to the central processing unit without any negative impact on computer performance. .
The HardCache-SL3/PC is equipped with software drivers and development tools that fully support the chip, reducing the cost of developing new security applications.
What is Via In Pad? In shortly,via in pad is the via holes are at the SMD pad.The vias are very small,usually under 0.3mm.Why and how? First is there is no enough space to layout,you have to put the vias and holes closer even together.Second it helps thermal management and for high frequency boards,it may help improve signals.
Because the SMD pads are for SMD components loading,so the solder can not flow to inner layer or the other side when assemble.That is the most important for via in pad board.
How PCB manufacturers like us to do via in pad board? We will fill all vias with non-conductive epoxy and plate copper over it ,so the vias are flat same as others. Many PCB factories are unable to do such capability.
The key technology is how we fill vias and guarantee there is no any solder (surface finishing) in the holes.
Filled via in pad is a way to achieve intermediate density with an intermediate cost compared to using blind/buried vias. Some of the key advantages associated with using the via in pad technology are:
.Fan out fine pitch (less than .75mm) BGAs
.Meets closely packed placement requirements
.Better thermal management
.Overcomes high speed design issues and constraints i.e. low inductance
.No via plugging is required at component locations
.Provides a flat, coplanar surface for component attachment
Via in big pads are not a big problem.but for BGA,that is technology.As BGA pads are very small,10mil or 12mil,and there is no enough space.Manufacturing is not easy as other boards.