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In recent years, the luminous efficiency of light-emitting diodes ( LEDs ) has been greatly improved. Due to the low power consumption and long-life characteristics of light-emitting diodes, it is generally believed that future light-emitting diodes are expected to become the next generation of energy-saving lighting sources. The development trend of LEDs has long been highly anticipated by the world, especially the blue light using high-efficiency InGaN-based luminescent layers, and the use of green high-output LEDs, and the yellow, orange, and red of the 4-element AlGaInP luminescent layer. The high-luminance LED of light suddenly became the focus of global attention.
At present, these LEDs with luminous efficiency surpassing traditional fluorescent lamps and white heat bulbs have been gradually commercialized, and at the same time, they continue to expand market scale and application fields. Then this article will deeply explore the 4-element AlGaInP red LED chip , which is widely used in various fields, high-luminance technology and manufacturing method.
Chip characteristics
The LED chip is a diode with a light-emitting function, and its outer shape is only about 0.2 to 1 mm in a rectangular shape. As shown in Fig. 1(b), the commercial LED is fixed on the package substrate and the lead frame, and the gold wire is laid and then sealed with a transparent resin. The LEDs are packaged in various shapes such as a bullet-type, a front surface, a side light-emitting surface type, and a large-power bulb type in consideration of heat dissipation.
There are also many types of LED chips themselves, and the structure of LED chips is quite different depending on the way the package is assembled. In addition, the size of the LED chip must be selected according to the power used. Fig. 1(a) is a cross-sectional structural view of a bump bump type LED using a bump bump method. The characteristics of the LED depend on the illuminating performance of the LED chip, the light extraction efficiency after packaging, and the concentrating technology. Therefore, the high luminance of the chip, the high performance of the package, and the optimized design of the chip and the package are very important.