Several factors to be considered in high-power LED packaging technology have also raised several points in the key technologies of packaging. mainly include: (1) In terms of high-power LED heat dissipation : Consider a low thermal resistance package. The LED chip is a solid-state semiconductor device that is the core of the LED light source. Since the high-power LED chips are of different sizes, the driving method uses a constant current driving method. The electric energy can be directly converted into light energy. Therefore, the LED chip needs to absorb most of the input electric energy during the lighting process, and a large amount of heat is generated in the process. Therefore, the heat dissipation technology for high-power LED chips is an important technology for LED packaging technology, and it is also a key problem that must be solved in the process of high-power LED packaging of Xinyuan. (2) The heart of the LED is a semiconductor wafer. One end of the chip is attached to a bracket, one end is a negative pole, and the other end is connected to the positive pole of the power source. Therefore, the high light extraction package structure is also an important key technology in the process of high-power LED packaging. In the process of illuminating the LED chip, during the emission process, due to the difference in refractive index at the interface, the loss of photon reflection and the total loss of reflection may be caused. Therefore, a relatively high refractive index transparent layer may be coated on the surface of the chip. glue. This layer of transparent plastic must have high light transmittance, high refractive index, good fluidity, easy spraying, and good thermal stability. Currently commonly used transparent adhesive layers are epoxy resin and silica gel. 2, the purpose of the package Semiconductor packages enable diodes, transistors, ICs, etc. to maintain their own airtightness, protect them from humidity and temperature in the surrounding environment, and prevent electronic components from being damaged by mechanical vibrations and shocks. Therefore, the purpose of the package is as follows: (1) Prevent moisture from entering from the outside; (2) mechanically supporting the wire; (3) effectively discharging the heat generated inside; (4) Provide a form that can be held by hand. The semiconductor component packaged by ceramics and metal materials has better airtightness and higher cost, and is suitable for use in applications where the tightness is high. Semiconductor packages packaged in plastics have poor airtightness, but are low in cost, and thus become mainstream in household appliances such as televisions, telephones, computers, and radios. The domain of screen protection is witnessing a technological metamorphosis, thanks to UV Curing Film Machines. These devices collaborate with cutting-edge screen protectors – such as UV Protective Curing Films – ensuring screens are not only shielded from damage but also receive a flawless application.
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