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At the 2014 High-tech LED Annual Conference, the first-ever conference on the “Strategy of the Industry Strategyâ€, which was named by Zhongweiguang Electronics, Zheng Xiantao, general manager of the LED business unit of Getian Optoelectronics, mentioned that it has many advantages such as stable performance, high cost performance and flexible application. The flip chip package will bring new market opportunities to domestic packaging companies in the “micro-profit eraâ€.
The concept of "flip-chip" is fiery. Philips Lumileds has introduced flip chip packaging technology as early as 2007. Currently, it is very complete in the flip-chip single device product line, but the COB device is still using the gold wire packaging process. “COB devices use flip-chip packaging technology, which is not cost-effective,†Zhou Xuejun, director of Asian marketing at Philips Lumileds told reporters.
According to the reporter, in addition to Philips Lumileds, domestic packaging companies including Hongli Optoelectronics, Getian Optoelectronics, Jingke Electronics, Yimeixinguang, etc., have launched their own flip chip packaging products, and this year's high The LED Golden Globe Awards will be launched on the same stage with their own flip chip packaging products.
“Currently, our flip-chip packaging products are mainly produced by alloy welding process. This processing method is more secure in terms of product quality.†Hu Shuangneng, deputy general manager of Getian Optoelectronics, said that the gold-tin eutectic soldering process needs to be purchased. A series of professional equipments for the production of flip chip products, such as crystal machine and splitting machine, have a total investment of about 10 million RMB, and the cost is high.
"Although the price/performance ratio needs to be improved, the current domestic flip-chip technology is approaching maturity, because in terms of flip-chip technology, we are almost at the same starting line with foreign companies." Hu Shuangneng said that foreign countries began to develop vertical and formal chip technology from the 1980s. At present, they have advantages in these two areas, but there is no significant gap in technology in flip-chip technology.
Although the concept of flip-chip packaging is hot, its high cost has largely hindered its marketization, leading to the current market pattern of large-scale thunder sound, small raindrops and awkwardness.
The market reaction is cold. "The flip chip we are currently producing is still in the sample test stage for packaging companies." Dr. Wei Shizhen, vice president of Huacan Optoelectronics, told reporters that this situation of Huacan Optoelectronics is also the most in China. A state in which a chip manufacturer is installed.
Some insiders also said that the biggest problem of flip-chip technology is the maturity of the supply chain. At present, everyone's production capacity is not large, and there are too few enterprises that can batch-flip. The price difference between the flip chip and the dress chip of the same size on the market is about 3-10 times. In addition, the cost of flip-chip process equipment directly leads to the high price of flip-chip devices.
"At present, the flip-chip devices we produce are not much. At the same time, our flip-chip products are mainly for the European and American markets. As far as the current market situation is concerned, the difficulty of flip-chip devices in domestic promotion is still relatively high. Li Feng, director of the Optoelectronics Marketing Department, told reporters that European and American buyers are very interested in flipping this new technology and will not be too picky on the price.
It is reported that in the domestic market, many luminaire manufacturers still mainly assemble products. At the same time, some small and medium-sized luminaire enterprises generally select accessories products according to the market's general market conditions due to the lack of experimental equipment. The phenomenon of following the trend is still serious. . Therefore, in the case that some large-scale lighting companies do not have large-scale flip-chip products, most domestic lighting manufacturers do not dare to act rashly.
"In this case, cost is a part of the factor. But at the same time, it is necessary for a new product to be widely distributed in the market as a new product," Li Feng said. 
[Text|High-tech LED reporter Xiong Yuheng] The continuous expansion of the downstream application market, the demand for cost performance is also constantly improving, which also drives the continuous improvement of packaging technology. In the past two years, the packaging method of flip chip packaging has been hot in the entire LED industry. The flip chip package differs from the conventional package in that the conventional package is formed by bonding the chip to the substrate by wire bonding, and the flip chip package is to flip the chip so that the electrode is directly connected to the substrate.